Apple silicon roadmap: A jam-packed patent and rumor round-up (video)

From Vadim Yuryev's "Apple's M2 Ultra DUO Mac Pro will be LEGENDARY!" posted Saturday on the Max Tech YouTube channel:

In this video, I go through a bunch of leaks, rumors and common sense reasons for why I believe Apple's Mac Pro in coming this year instead of getting delayed like many people out there are theorizing. I then get into Apple's patents for how they were able to create the M1 Ultra chip, including routing 10,000+ signals through the UltraFusion interposer communication bridge. Then, I get into more patents that Apple filed for, including new 3D chipmaking technology for how Apple can create the M2 Ultra Duo chip.

Cue the video:

My take: Does Yuryev know what he's talking about? He certainly has a following. Max Tech has 890,000 subscribers. Within 24 hours of its posting Yuryev's video had been viewed 105,000 times and drawn more than 675 comments.

7 Comments

  1. Robert Douglass said:
    @ Joseph, Thanks for your ‘40,000 foot’ point of view. (pun intended). I tend to also lean towards scenario 2; but I wonder what kinds of strategies Tim Cook is entertaining, to ‘thread-the-needle’ for the next 6-12 months.
    Has he stockpiled chips?… I seriously doubt it, what with the pressing shortages. I know he’s cultivating India for assembly, but it’s not really ‘there’ yet. On the other hand, I believe Apple is one of the larger employers of Chinese labor, so there’s that ‘umbrella’… It’s just a very difficult situation to try to parse the outcomes.

    1
    March 13, 2022
  2. David Drinkwater said:
    I’m not really convinced that Yuryev does know what he is talking about. He sure is very enthusiastic, though.

    Remember, Apple frequently patents things that never see the light of day.

    I have a lot more faith in the idea of connecting die together in the X (or alternately Y) direction with many interconnect wires (as they have done with the M1 Ultra) than connecting them together in the Z direction (up-down). Through silicon vias are tough. Bumps are achievable, but 10,000 of them? Hard to imagine. Additionally, insulator silicon (the bulk of the mechanical silicon that supports the active device portion of the silicon) is a poor heat conductor.

    I’m not saying its impossible to do, but if they are successful, I’d very nearly donate very personal body parts to see the process.

    0
    March 15, 2022
  3. George Row said:
    An interesting video of a tear down of the Mac Studio Ultra: https://youtu.be/IY0gRMpT4AY
    from Max Tech.
    I am hoping that this shows on the right margin, despite the article being from the start of the week.

    0
    March 19, 2022

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